The production process, based on indium phosphide and/or gallium arsenide, starts from the wafer production and ends with component manufacturing
- Photonic Integrated Circuit InP and GaAs based
- Broadband SLED solutions
- Narrow and Ultra narrow bands Laser solutions
- Programmable devices
- BTF/DIL/TO/TOSa package
- Active & Passive Components
- Uncooled Laser Diode (TO…)